Atomic layer deposition (ALD) is a vapor phase deposition technique mainly used for the synthesis of ultrathin films of inorganic materials, with a subnanometer thickness control.
ALD can be used to coat demanding 3D substrates with a conformal and uniform layer of high quality material, a capability unique amongst thin film deposition techniques.
The ability to synthesize and control a material at the nanoscale level, and furthermore to etch it atomic layer by atomic layer as well (thanks to Atomic layer Etching), shows the enormous possibilities the scientists have and that nearly every tuning one imagine is possible.
Atomic Layer Deposition is THE technology that makes anything possible (from a material scientist perspective)!
Consequently, ALD-grown materials have a wide range of applications, from displays to microelectronics, and from nanocatalysts to photovoltaics.
This is a booming technology, currently used for the manufacturing of novel processors and memories, and definitely growing further in the coming years!